Sandisk Corporation has announced that it has commenced the production of its 3D NAND chips with storage capacity of up to 256GB. D NAND of this 256Gbit is a 3bit / cell of the MLC and its memory cell array consists of 48 layers made using BiCS (Bit Cost Scalable) technology. Sandisk claims that this is world’s first.
SanDisk has developed this 3D NAND tech in collaboration with Toshiba. Its experimental production was carried out at the Yokkaichi plant, Japan where both Toshiba and Sandisk operate.
The products equipped with this 3D NAND will be launched in 2016.